Methods of improvement

Reliability of semiconductors is kept high through several methods. Cleanroomslm2576hvt-adj

 control impurities, process control controls processing,MB501L

 and burn-in (short term operation at extremes) and probe and test reduce escapes. Probe (wafer prober) testsTDA2630

 the semiconductor die, prior to packaging, via micro-probes connected to test equipment. Wafer testing tests the packaged device,2SA114

 often pre-, and post burn-in for a set of parameters that assure operation. Process and design weaknesses are identified by applying a set of stress tests inHCT126M

 the qualification phase of the semiconductors before their market introduction e. g. according to the AEC Q100 and Q101 stress qualifications.